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AMD CDNA 3
Methods ↗

7 entities and 8 documented connections shown.

Connections

7 entities · 8 claims
100%

Drag the map or use pan buttons to move. Tab to a node or connection and press Enter to inspect its evidence. Arrows follow the actual claim direction.

STARTING ENTITYDIRECT CONNECTIONSSECOND STEPDesigned by · SUPPORTEDDesigned byBased on architecture · SUPPORTEDBased on architectureBased on architecture · SUPPORTEDBased on architectureUses packaging · SUPPORTEDUses packagingUses packaging · SUPPORTEDUses packagingUses memory technology · SUPPORTEDUses memory technologyBased on architecture · SUPPORTEDBased on architectureUses memory technology · SUPPORTEDUses memory technologyAMD Instinct MI300X · productPRODUCTAMD Instinct MI300XHBM3 · memory technologyMEMORY TECHNOLOGYHBM3AMD · companyCOMPANYAMDAMD CDNA 3 · architectureARCHITECTURESTARTAMD CDNA 3AMD Zen 4 · architectureARCHITECTUREAMD Zen 43D packaging · packagingPACKAGING3D packagingAMD Instinct MI300A · productPRODUCTAMD Instinct MI300A
CompanyChip / productTechnologyPlace / facility
Select a connection for its evidence
Relationships & evidence (8)
Every displayed connection is a scoped claim. Arrows follow subject to object.
SubjectRelationshipObjectStatusEvidence
AMD Instinct MI300XAMDSUPPORTEDSource-reported snapshot: 2023-12-06
Why are these connected?

Product authorship statement; not a manufacturing claim.

Full claim history →
AMD Instinct MI300AAMD Zen 4SUPPORTEDSource-reported snapshot: 2023-12-06
Why are these connected?

This is a heterogeneous APU claim, not a relationship to an external CPU supplier.

Full claim history →
AMD Instinct MI300AAMD CDNA 3SUPPORTEDSource-reported snapshot: 2023-12-06
Why are these connected?

This claim covers the GPU-side architecture only.

Full claim history →
AMD Instinct MI300A3D packagingSUPPORTEDSource-reported snapshot: 2023-12-06
Why are these connected?

No external packaging service provider is asserted.

Full claim history →
AMD Instinct MI300X3D packagingSUPPORTEDSource-reported snapshot: 2023-12-06
Why are these connected?

No external packaging service provider is asserted.

Full claim history →
AMD Instinct MI300XHBM3SUPPORTEDSource-reported snapshot: 2023-12-06
Why are these connected?

No memory-chip vendor is asserted.

Full claim history →
AMD Instinct MI300XAMD CDNA 3SUPPORTEDSource-reported snapshot: 2023-12-06
Why are these connected?

Architecture designation does not determine the foundry or package supplier.

Full claim history →
AMD Instinct MI300AHBM3SUPPORTEDSource-reported snapshot: 2023-12-06
Why are these connected?

No memory-chip vendor is asserted.

Full claim history →
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Find a documented path

From AMD CDNA 3 · up to two relationship steps.

A path retains its original claims. Shared technology does not establish a supply contract.

7 nodes · 8 claims
Scope

Relationships may describe different dates. A path does not establish simultaneous activity. Bounded source-backed collection. Missing or filtered connections do not establish absence. Supported does not mean independently verified.