Auditable claim record
AMD Instinct MI300X · uses packaging
3D packaging · SUPPORTED
urn:vlsi:claim:9693cae0f840955cd8626d2e096ca44638e9f1433b8681e34a02071ee9b284a7
No external packaging service provider is asserted.
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Evidence
AMD's specifications mark MI300X as using 3D packaging with fourth-generation AMD Infinity Architecture.
AMD · Product Specifications table · supports
Published 2023-12-06 · Retrieved 2026-09-08T15:56:30.763Z
urn:vlsi:evidence:e368fbbb4a31c55d7a20496c3a348316741b0203f03b0ad6ae4b86bafc861e86
Assessment history
New assessments preserve earlier records. A correction changes the current interpretation without rewriting what VLSI knew before it.
Recorded assessments, oldest first| Revision | Recorded at (UTC) | Status | Validity | Reviewer & reason |
|---|
| 1 | 2026-09-08T15:57:21.457Z | SUPPORTED | point 2023-12-06
| curated-source-agent (agent) Evidence ingested by curated-primary-sources/1.0.0. No external packaging service provider is asserted. |