VLSI KoreaAMD Delivers Leadership Portfolio of Data Center AI Solutions with AMD Instinct MI300 Series
AMD says MI300A leverages 3D packaging and fourth-generation AMD Infinity Architecture.
- Published
- 2023-12-06
- Retrieved
- 2026-09-08
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3D packaging3 entities and 2 documented connections shown.
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| Subject | Relationship | Object | Status | Evidence |
|---|---|---|---|---|
| AMD Instinct MI300A | 3D packaging | SUPPORTEDSource-reported snapshot: 2023-12-06 | Why are these connected?No external packaging service provider is asserted. | |
| AMD Instinct MI300X | 3D packaging | SUPPORTEDSource-reported snapshot: 2023-12-06 | Why are these connected?No external packaging service provider is asserted. AMD Delivers Leadership Portfolio of Data Center AI Solutions with AMD Instinct MI300 SeriesAMD's specifications mark MI300X as using 3D packaging with fourth-generation AMD Infinity Architecture.
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