VLSI KoreaAMD Delivers Leadership Portfolio of Data Center AI Solutions with AMD Instinct MI300 Series
AMD presents MI300X as an AMD Instinct accelerator.
- Published
- 2023-12-06
- Retrieved
- 2026-09-08
SEMICONDUCTOR INTELLIGENCE
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- Microncompany
- HBM3ememory technology
- Yosyseda tool
- Micron Singapore HBM packaging facility projectfacility
- Micron HBM3E 24GB 8Hproduct
- Intelcompany
- NVIDIA fifth-generation NVLinkinterface
- SK hynixcompany
- AMD Instinct MI300Xproduct
- HBM2memory technology
- Blue Cheetah Analog Designcompany
- Icheon-si, Gyeonggi-do, Republic of Korearegion
- HBM3memory technology
- NVIDIA A100 Tensor Core GPUproduct
- NVIDIA Blackwell GPUs (2024 platform)product
- NVIDIA Hopper architecturearchitecture
- AMDcompany
- NVIDIA GA100 GPUchip
- TSMCcompany
- Phoenix, Arizona, United Statesregion
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5 entities and 4 documented connections shown.
CURRENT STARTING ENTITY
AMD Instinct MI300X
product · 5/40 entities · 4/60 connections · 1 relationship step
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Bounded source-backed collection. Missing or filtered connections do not establish absence. Supported does not mean independently verified.
SUPPORTED records a source-backed assertion. VERIFIED requires an identified human review. This map does not measure supplier concentration or prove that an unrecorded relationship is absent.
ACCESSIBLE RELATIONSHIP VIEW
Every connection, with its evidence.
| Subject | Relationship | Object | Status & dates | Evidence |
|---|---|---|---|---|
| AMD Instinct MI300X | AMD | SUPPORTEDSource-reported snapshot: 2023-12-06 | Why are these connected? · 1 source(s)Product authorship statement; not a manufacturing claim. | |
| AMD Instinct MI300X | 3D packaging | SUPPORTEDSource-reported snapshot: 2023-12-06 | Why are these connected? · 1 source(s)No external packaging service provider is asserted. AMD Delivers Leadership Portfolio of Data Center AI Solutions with AMD Instinct MI300 SeriesAMD's specifications mark MI300X as using 3D packaging with fourth-generation AMD Infinity Architecture.
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| AMD Instinct MI300X | HBM3 | SUPPORTEDSource-reported snapshot: 2023-12-06 | Why are these connected? · 1 source(s)No memory-chip vendor is asserted. AMD Delivers Leadership Portfolio of Data Center AI Solutions with AMD Instinct MI300 SeriesAMD specifies MI300X with 192 GB of HBM3 memory.
| |
| AMD Instinct MI300X | AMD CDNA 3 | SUPPORTEDSource-reported snapshot: 2023-12-06 | Why are these connected? · 1 source(s)Architecture designation does not determine the foundry or package supplier. AMD Delivers Leadership Portfolio of Data Center AI Solutions with AMD Instinct MI300 SeriesAMD states MI300X accelerators are powered by CDNA 3.
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Entities in this view (5)
- AMD Instinct MI300XproductExpand →
- HBM3memory technologyExpand →
- AMDcompanyExpand →
- AMD CDNA 3architectureExpand →
- 3D packagingpackagingExpand →
EVIDENCE PATHFINDER
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