VLSI KoreaSearch Hub
Find public resources, specifications, standards metadata, calculators, and tapeout programs.
Public metadata and educational tools only. Example profiles and research previews without sources are excluded. Dates and source limitations stay attached to each result.
45 results to explore
Specifications
AEC-Q100 Revision H
Automotive integrated-circuit qualification document family indexed from the official AEC document register; issue date is not asserted.
Source-linked · conditions applyCatalog date: 2026-08-29Source for AEC-Q100 Revision H (opens in a new tab)↗Specifications
CXL 1.1
Historical CXL revision retained for compatibility and genealogy research.
Specifications
CXL 2.0
Released CXL revision with only public high-level feature metadata.
Specifications
CXL 3.0
Source-linked CXL revision with public high-level protocol taxonomy.
Specifications
CXL 3.1
Source-linked revision entity for fabric and memory-system research.
Specifications
CXL 3.2
Version-level record for a released CXL specification.
Specifications
CXL 4.0
Publicly announced CXL revision; retain version, release date and access conditions only.
Specifications
GF180MCU
Open PDK entity for process-aware educational flow navigation.
Specifications
HBM4
Standards-taxonomy entity; capacities and bandwidth remain product-specific.
Specifications
IEC 61508-1:2010
Functional-safety general-requirements edition tracked from the IEC Webstore at catalog-metadata level.
Source-linked · conditions applyCatalog date: 2026-08-29Source for IEC 61508-1:2010 (opens in a new tab)↗Specifications
IEEE 1149.4-2024
Active mixed-signal test-bus standard tracked at public catalog-metadata level; controlled normative text is not reproduced.
Source-linked · conditions applyCatalog date: 2026-08-29Source for IEEE 1149.4-2024 (opens in a new tab)↗Specifications
Intel 14A
Intel Foundry process record using Intel's public architecture and power-delivery labels.
Specifications
Intel 18A
Foundry technology node entity; commercial availability requires dated source verification.
Specifications
Intel EMIB
Intel's embedded bridge packaging technology represented at public taxonomy level.
Specifications
Intel Foveros Direct
Intel 3D packaging technology with public hybrid-bonding taxonomy.
Source-linked · conditions applyCatalog date: 2026-08-28Source for Intel Foveros Direct (opens in a new tab)↗Specifications
IPC-A-610 Revision J
Current electronics-assembly acceptance revision indexed from IPC's public revision table; commercial standard text is excluded.
Source-linked · conditions applyCatalog date: 2026-08-29Source for IPC-A-610 Revision J (opens in a new tab)↗Specifications
MIL-STD-883-1 Change 2
Active microcircuit environmental-test-method standard tracked from the official DLA ASSIST catalog.
Source-linked · conditions applyCatalog date: 2026-08-29Source for MIL-STD-883-1 Change 2 (opens in a new tab)↗Specifications
MIPI CSI-2 v4.2
Current CSI-2 version and public imaging-interface metadata linked to MIPI; member-only specification text is excluded.
Source-linked · conditions applyCatalog date: 2026-08-29Source for MIPI CSI-2 v4.2 (opens in a new tab)↗Specifications
MIPI D-PHY v3.6
Current D-PHY version and public scope metadata linked to the official MIPI overview; member-only specification text is excluded.
Source-linked · conditions applyCatalog date: 2026-08-29Source for MIPI D-PHY v3.6 (opens in a new tab)↗Specifications
OpenLane 2
Open-source ASIC-flow entity for reproducible toolchain navigation.