VLSI KoreaSearch Hub
Find public resources, specifications, standards metadata, calculators, and tapeout programs.
Public metadata and educational tools only. Example profiles and research previews without sources are excluded. Dates and source limitations stay attached to each result.
153 results to explore
Tapeout & PDKs
SMART Photonics MPW
Past deadlines are not presented as open runs. Use the official page for the next intake.
Current run status and future inquiries are controlled by the official pageCatalog date: 2026-08-28Source for SMART Photonics MPW (opens in a new tab)↗Specifications
SPHBM4
JEDEC-named HBM4-class bandwidth standard entity; preserve product and topology conditions.
Calculators
SRAM Bitcell Array Area
First-order array-only area estimate.
Derived · educational calculationCatalog date: 2026-08-26Source for SRAM Bitcell Array Area (opens in a new tab)↗Open silicon
SymbiYosys
A front end for reproducible safety, liveness, cover, and equivalence flows using open formal engines.
Tapeout & PDKs
Teledyne DALSA MIDIS Shuttle
This record confirms the MEMS shuttle pathway; cost, fit and schedule remain provider-controlled.
Official shuttle service; current run dates require direct confirmationCatalog date: 2026-08-28Source for Teledyne DALSA MIDIS Shuttle (opens in a new tab)↗Tapeout & PDKs
Tiny Tapeout
Community open-source ASIC shuttle program.
public project and current shuttle information pageCatalog date: 2026-08-26Source for Tiny Tapeout (opens in a new tab)↗Tapeout & PDKs
Tower Semiconductor MPW Shuttle
The displayed milestone is RFSOI-specific. Do not generalize it to every Tower process.
Official external schedule lists process-specific 2026 tape-insCatalog date: 2026-08-28Source for Tower Semiconductor MPW Shuttle (opens in a new tab)↗Specifications
TSMC A16
Foundry-specific A16 process record; no cross-foundry node equivalence is implied.
Specifications
TSMC CoWoS
TSMC's chip-on-wafer-on-substrate advanced-packaging family.
Tapeout & PDKs
TSMC CyberShuttle
The process range is a public service headline; current runs, eligibility, price and delivery require TSMC confirmation.
Official service exists; current schedule is customer-portal controlledCatalog date: 2026-08-28Source for TSMC CyberShuttle (opens in a new tab)↗Specifications
TSMC N2
Foundry-specific node entity, not a cross-foundry equivalence class.
Specifications
TSMC N2P
N2-family extension represented from TSMC's own process taxonomy.
Specifications
TSMC N3P
N3-family process variant represented without normalized cross-foundry claims.
Tapeout & PDKs
TTIHP26b
The official listing states that future dates may change. Availability, acceptance, delivery and yield are not guaranteed by VLSI Tapeout.
Open listing — verify official live datesCatalog date: 2026-08-26Source for TTIHP26b (opens in a new tab)↗Tapeout & PDKs
TTSKY26c
Prices, slots, schedule and delivery are taken only from the official program at time of view.
Open listing — verify official live datesCatalog date: 2026-08-26Source for TTSKY26c (opens in a new tab)↗Specifications
UCIe 1.0
First released UCIe generation represented at version-metadata level.
Specifications
UCIe 1.1
Backward-compatible UCIe revision record.
Specifications
UCIe 2.0
Interface entity connected to packages, chiplets and public standards metadata.
Specifications
UCIe 3.0
Version record for public release metadata and mode-conditioned comparisons.
Tapeout & PDKs
UMC Silicon Shuttle
Monthly plan categories are public. Exact dates, availability and commercial terms are not inferred.
Official monthly plan; exact cutoff requires provider confirmationCatalog date: 2026-08-28Source for UMC Silicon Shuttle (opens in a new tab)↗