VLSI KoreaSearch Hub
Find public resources, specifications, standards metadata, calculators, and tapeout programs.
Public metadata and educational tools only. Example profiles and research previews without sources are excluded. Dates and source limitations stay attached to each result.
45 results to explore
Specifications
OpenROAD
Open-source physical-design platform entity.
Specifications
PCI Express 6.x
Revision-family record; electrical and protocol details remain version-specific.
Source-linked · conditions applyCatalog date: 2026-08-28Source for PCI Express 6.x (opens in a new tab)↗Specifications
PCI Express 7.0
Public release metadata for the PCIe 7.0 base specification.
Source-linked · conditions applyCatalog date: 2026-08-28Source for PCI Express 7.0 (opens in a new tab)↗Specifications
RISC-V RVA22 Profile
Ratified application-processor profile metadata linked to the official reference.
Source-linked · conditions applyCatalog date: 2026-08-28Source for RISC-V RVA22 Profile (opens in a new tab)↗Specifications
RISC-V RVA23
Profile entity with status and implementation scope separated.
Source-linked · conditions applyCatalog date: 2026-08-26Source for RISC-V RVA23 (opens in a new tab)↗Specifications
RISC-V Vector Extension
Open ISA extension entity with version-specific source links.
Source-linked · conditions applyCatalog date: 2026-08-26Source for RISC-V Vector Extension (opens in a new tab)↗Specifications
Samsung I-Cube
Samsung 2.5D packaging family represented from its official technology catalog.
Source-linked · conditions applyCatalog date: 2026-08-28Source for Samsung I-Cube (opens in a new tab)↗Specifications
Samsung SF2
Foundry-specific process entity with date-sensitive commercialization metadata.
Source-linked · conditions applyCatalog date: 2026-08-26Source for Samsung SF2 (opens in a new tab)↗Specifications
Samsung SF2Z
Samsung Foundry process variant with publicly announced backside power delivery.
Source-linked · conditions applyCatalog date: 2026-08-28Source for Samsung SF2Z (opens in a new tab)↗Specifications
Samsung SF4U
Samsung Foundry 4 nm-family variant tracked as an announced foundry-specific label.
Source-linked · conditions applyCatalog date: 2026-08-28Source for Samsung SF4U (opens in a new tab)↗Specifications
Samsung X-Cube
Samsung 3D integration family represented without product-level supplier inference.
Source-linked · conditions applyCatalog date: 2026-08-28Source for Samsung X-Cube (opens in a new tab)↗Specifications
SEMI E10-0422
Current equipment reliability, availability, maintainability and utilization standard represented from SEMI's public store metadata.
Source-linked · conditions applyCatalog date: 2026-08-29Source for SEMI E10-0422 (opens in a new tab)↗Specifications
SEMI E12-0421
Current mass-flow measurement units guide represented from SEMI's public catalog without reproducing the paid document.
Source-linked · conditions applyCatalog date: 2026-08-29Source for SEMI E12-0421 (opens in a new tab)↗Specifications
SkyWater SKY130
Open PDK entity; record exact PDK release/variant in child fields.
Source-linked · conditions applyCatalog date: 2026-08-26Source for SkyWater SKY130 (opens in a new tab)↗Specifications
SPHBM4
JEDEC-named HBM4-class bandwidth standard entity; preserve product and topology conditions.
Specifications
TSMC A16
Foundry-specific A16 process record; no cross-foundry node equivalence is implied.
Specifications
TSMC CoWoS
TSMC's chip-on-wafer-on-substrate advanced-packaging family.
Specifications
TSMC N2
Foundry-specific node entity, not a cross-foundry equivalence class.
Specifications
TSMC N2P
N2-family extension represented from TSMC's own process taxonomy.
Specifications
TSMC N3P
N3-family process variant represented without normalized cross-foundry claims.