Micron Singapore HBM packaging facility project

Canonical entity with source-backed relationships and retained history.

urn:vlsi:entity:0ad0fb4b-74cf-409e-acfb-2ff3226144c7

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A source-reported date is a historical snapshot. Unknown validity is excluded when a date is selected. “Known to VLSI” uses the end of that UTC day. This entity’s heading uses its current label.

Recorded relationships

SUPPORTED1 evidence record · Revision 1

Micron Singapore HBM packaging facility projectLocated inSingapore

Announced Singapore HBM packaging facility project.

Planned relationship. This source does not establish completed production.

Source-reported snapshot: 2025-01-08

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Evidence index 85/100 · A rule-based index, not the probability this claim is true. 1 independent source origin(s).

Dated source-reported snapshot. Publication date is not an inferred manufacturing start, contract start or legal-close date.

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore ↗

Micron · Tier A · Primary source · supports

Evidence summary: Micron announced a new HBM advanced-packaging facility in Singapore.

Location: Release title and first paragraphs

Published: 2025-01-08 · Retrieved: 2026-09-08 · Extraction: manual-source-review

Store factual paraphrase, metadata and link only. No source document redistribution or inferred license; no source bytes retained.

First observed by VLSI: 2026-09-08T15:57:21.457Z. No independent human verification recorded.

Review: Evidence ingested by curated-primary-sources/1.0.0. The source is a groundbreaking announcement; no current production implied.

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RETRACTED1 evidence record · Revision 2

Micron Singapore HBM packaging facility projectOperated byMicron