Knowledge / company
Micron Canonical entity with source-backed relationships and retained history.
urn:vlsi:entity:065d5ef4-351f-4545-9734-a516c6074ae5
A source-reported date is a historical snapshot. Unknown validity is excluded when a date is selected. “Known to VLSI” uses the end of that UTC day. This entity’s heading uses its current label.
Recorded relationships RETRACTED 1 evidence record · Revision 2
Micron Supplies memory technology HBM3e Manufacturer-reported HBM3E production at the publication date.
Source-reported snapshot: 2024-02-26
Inspect evidence, confidence and history Evidence index 85/100 · A rule-based index, not the probability this claim is true. 1 independent source origin(s).
Dated source-reported snapshot. Publication date is not an inferred manufacturing start, contract start or legal-close date.
Micron · Tier A · Primary source · supports
Evidence summary: The manufacturer reports producing HBM3E.
Location: Boise dateline
Published: 2024-02-26 · Retrieved: 2026-09-08 · Extraction: manual-source-review
Store factual paraphrase, metadata and link only. No source document redistribution or inferred license; no source bytes retained.
First observed by VLSI: 2026-09-08T15:57:21.457Z. No independent human verification recorded.
Review: A volume-production announcement is not itself a generalized supply relationship. Keep the named Micron product and production snapshot.
Full claim history → RETRACTED 1 evidence record · Revision 2
Announced Singapore HBM packaging facility project.
Planned relationship. This source does not establish completed production.
Source-reported snapshot: 2025-01-08
Inspect evidence, confidence and history Evidence index 85/100 · A rule-based index, not the probability this claim is true. 1 independent source origin(s).
Dated source-reported snapshot. Publication date is not an inferred manufacturing start, contract start or legal-close date.
Micron · Tier A · Primary source · supports
Evidence summary: Micron announced the HBM packaging facility project.
Location: Release title and first paragraphs
Published: 2025-01-08 · Retrieved: 2026-09-08 · Extraction: manual-source-review
Store factual paraphrase, metadata and link only. No source document redistribution or inferred license; no source bytes retained.
First observed by VLSI: 2026-09-08T15:57:21.457Z. No independent human verification recorded.
Review: A groundbreaking announcement does not establish an operating facility. Retain the planned project location and seek explicit operating status.
Full claim history → SUPPORTED 1 evidence record · Revision 1
Named HBM3E product in this manufacturer release.
Source-reported snapshot: 2024-02-26
Inspect evidence, confidence and history Evidence index 85/100 · A rule-based index, not the probability this claim is true. 1 independent source origin(s).
Dated source-reported snapshot. Publication date is not an inferred manufacturing start, contract start or legal-close date.
Micron · Tier A · Primary source · supports
Evidence summary: The manufacturer reports volume production of its named HBM3E product.
Location: Boise dateline
Published: 2024-02-26 · Retrieved: 2026-09-08 · Extraction: manual-source-review
Store factual paraphrase, metadata and link only. No source document redistribution or inferred license; no source bytes retained.
First observed by VLSI: 2026-09-08T15:57:21.457Z. No independent human verification recorded.
Review: Evidence ingested by curated-primary-sources/1.0.0. The release date is an observation of production status, not its exact start date.
Full claim history → Connections through a shared technology show an ecosystem association. They do not establish a supply contract, exclusive dependency or supplier share. Inspect coverage gaps → 
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